DRAM

This week as part of the annual Hot Chips semiconductor conference, Samsung’s memory division has presented a poster/slides on a project it is currently working on with impressive end-point results. The company details a 512 GB module of DDR5 memory, running at DDR5-7200, designed for server and enterprise use. This is a step up from the 256 GB modules at the top end of the market today, but to get there, Samsung has been introducing some new features and functionality.

Cadence DDR5 Update: Launching at 4800 MT/s, Over 12 DDR5 SoCs in Development

JEDEC still has not published the DDR5 specification officially, yet it looks like DRAM makers and SoC designers are preparing for the DDR5 launch at full steam. Cadence, which...

20 by Anton Shilov on 3/27/2020

TeamGroup Announces 32GB T-Force Vulcan Z and Dark Z DDR4 Modules

One of the world's largest DRAM memory manufacturers TeamGroup has unveiled its first DDR4 memory kits featuring 32 GB sticks under its gaming-focused T-Force brand. The T-Force Vulcan Z...

7 by Gavin Bonshor on 3/27/2020

Micron to Launch HBM2 DRAM This Year: Finally

Bundled in their latest earnings call, Micron has revealed that later this year the company will finally introduce its first HBM DRAM for bandwidth-hungry applications. The move will enable...

14 by Anton Shilov on 3/27/2020

Samsung to Produce DDR5 in 2021 (with EUV)

Samsung is on track to start volume production of DDR5 and LPDDR5 memory next year using a manufacturing technology that will take advantage of extreme ultraviolet lithography (EUVL). In...

20 by Anton Shilov on 3/25/2020

Micron Develops uMCP with LPDDR5 & 96L 3D NAND for Midrange 5G Smartphones

Micron this week has announced that it has started sampling the industry’s first multichip package (MCP) that integrates LPDDR5-6400 DRAM and 96-layer 3D NAND flash memory. The uMCP5 device...

11 by Anton Shilov on 3/11/2020

Rambus Develops HBM2E Controller & PHY: 3.2 Gbps, 1024-Bit Bus

The latest enhancements to the HBM2 standard will clearly be appreciated by developers of memory bandwidth-hungry ASICs, however in order to add support of HBM2E to their designs, they...

42 by Anton Shilov on 3/6/2020

GIGABYTE Launches Designare DDR4-3200 Memory, a 64 GB Kit

GIGABYTE is a relatively new player on the memory market, yet it clearly wants to participate in the premier league. As seen at CES, this week the company introduced...

23 by Anton Shilov on 2/6/2020

JEDEC Updates HBM2 Memory Standard To 3.2 Gbps; Samsung's Flashbolt Memory Nears Production

After a series of piecemeal announcements from different hardware vendors over the past year, the future of High Bandwidth Memory 2 (HBM2) is finally coming into focus. Continuing the...

24 by Ryan Smith on 2/3/2020

SK Hynix to Cut CapEx, Accelerate Transitions, 1z nm DRAM & 128L 4D NAND in 2020

Following a massive revenue and profitability drop in 2019, SK Hynix has announced that it plans to cut down its capital expenditures. While the market has shown some signs...

6 by Anton Shilov on 2/3/2020

The Corsair DDR4-5000 Vengeance LPX Review: Super-Binned, Super Exclusive

The consumer memory industry has been teasing DDR4-5000 for a few months now. We saw one company show some DDR4-5000 modules at Computex back in July 2019, running...

56 by Gavin Bonshor on 1/27/2020

Here's Some DDR5-4800: Hands-On First Look at Next Gen DRAM

Just like all major makers of DRAM, SK Hynix produced its first DDR5 memory chips a couple of years ago and has been experimenting with the technology since then...

39 by Anton Shilov on 1/13/2020

DRAMeXchange: Blackout at Samsung’s Fab Will Not Affect Commodity DRAM Prices in Q1

Following a power outage and consequent disruption of production at Samsung’s Line 13 fab in Hwaseong, South Korea, back on December 31, 2019, there had been some concerns about...

5 by Anton Shilov on 1/9/2020

CES 2020: Micron Begins to Sample DDR5 RDIMMs with Server Partners

Micron announced at CES that it had started sampling of its DDR5 Registered DIMMs with select partners. The very fact that Micron started sampling of DDR5 modules indicates that...

7 by Anton Shilov on 1/7/2020

An Interconnected Interview with Intel’s Ramune Nagisetty: A Future with Foveros

I’ve constantly stated for the last two years that the next battleground in performance for the semiconductor market is going to be in the interconnect – whether we’re speaking...

19 by Dr. Ian Cutress on 1/3/2020

Samsung’s Fab in Hwaseong Suffers Power Outage

Samsung had to stop production of DRAM and V-NAND memory at its fab near Hwaseong, South Korea, due to power outage earlier this week. Damage caused by disruption of...

48 by Anton Shilov on 1/2/2020

Micron Obtains License to Sell DRAM & NAND to Huawei

The inclusion of Huawei into the U.S. Department of Commerce’s Entity List and consequent restrictions to work with the Chinese giant clearly made it much harder for the U.S.-based...

12 by Anton Shilov on 12/19/2019

ChangXin Memory Technologies (CXMT) is Ramping up Chinese DRAM Using Qimonda IP

ChangXin Memory Technologies (CXMT), previously known as Innotron, has started production of computer memory using a 19 nm manufacturing technology. The company has a roadmap for at least two...

15 by Anton Shilov on 12/2/2019

SK Hynix Develops 16 Gb DDR4 Chips for 32 GB Modules

SK Hynix announced on Monday that it has completed development of its first monolithic 16 Gb chip. This chip is to be made using its 3rd Generation 10 nm-class...

7 by Anton Shilov on 10/22/2019

Royal Memory: G.Skill’s 32 GB DDR4-4000 CL15 Kit for AMD & Intel

Bucking the trend of ever higher clocked DDR4 memory kits, G.Skill has introduced a new high-end memory kit that is focused on lower memory latencies. Compatible with both Intel...

14 by Anton Shilov on 10/21/2019

Corsair 16GB DDR4-5000 Vengeance LPX Memory Kit: Built for AMD Ryzen 3000 and MSI

The high-tech industry loves milestones that are round numbers, be it frequency, number of cores, transistor count or something else. It is not that extra 100 MHz – 200...

38 by Anton Shilov on 10/11/2019

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