Rapidus, a Japan-based company developing 2nm process technology and aiming to commercialize it in 2027, will receive a huge government grant for its ongoing projects. The Japanese government will support Rapidus with subsidies totaling ¥590 billion yen ($3.89 billion). In addition to developing its 2nm production node and spending on cleanroom equipment, Rapidus will also fund the development of multi-chiplet packaging technology.

This extra funding will significantly help the company's ambitious plans. With the government's total support now at ¥920 billion ($6.068 billion), Rapidus is getting a solid push to become a significant player in the semiconductor industry. The whole project is expected to cost around ¥5 trillion ($32.983 billion), so the funding is not quite there yet. Meanwhile, the company may get enough financing with support from the Japanese government and large Japanese conglomerates like Toyota Motor and Nippon Telegraph and Telephone.

According to Atsuyoshi Koike, Rapidus's chief executive, the company is on track to start testing its production by April 2025 and aims to begin large-scale production by 2027. Commercial production of 2nm chips is set to commence sometime in 2025.

In addition to developing its 2nm fabrication process in collaboration with IBM and building its manufacturing facility, Rapidus is also working on advanced packaging technology for multi-chiplet system-in-packages (SiPs). The latest government subsidies include more than ¥50 billion ($329.85 million) for research and development in this area, the first time Japan has provided subsidies for such technologies.

It is noteworthy that Rapidus will use a section of Seiko Epson Corporation's Chitose Plant (located in Chitose City, Hokkaido) for its back-end packaging processes. This plant is near the company's fab, which is currently being built in Bibi World, an industrial park in Chitose City. This space will be dedicated to pilot-stage research and development activities.

Sources: RapidusNikkei

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  • Terry_Craig - Tuesday, April 2, 2024 - link

    It's very difficult to believe that with such a limited budget they will be able to produce chips worthy of being called 2nm; not to mention the tons of patents they might bump into along the way.
  • Dante Verizon - Tuesday, April 2, 2024 - link

    It doesn't seem like a viable goal. But as usual... The important thing is to enrich a few figures with investors' money.
  • Soulkeeper - Tuesday, April 2, 2024 - link

    Tax payer money. Redistribuition of wealth.
  • ballsystemlord - Tuesday, April 2, 2024 - link

    You know it!
  • Tilmitt - Monday, April 8, 2024 - link

    It could be worse, at least it's not going to single mothers.
  • Oxford Guy - Friday, April 12, 2024 - link

    Uh... Japan is facing a labor shortage because not enough Japanese want to have children.
  • mode_13h - Wednesday, April 17, 2024 - link

    To a large extent, this could be addressed if Japan were more welcoming of foreigners. It's not easy to immigrate there and you're typically not treated well if you do.

    It's a good thing they have a fetish for robots, because they'll need to automate most of their society, before long.
  • The Hardcard - Tuesday, April 2, 2024 - link

    There won’t be any patent issues. This is IBM 2 nm technology which they announced with wafer in 2021. They are just building a production line, IBM completed the node research and development.
  • Dante Verizon - Wednesday, April 3, 2024 - link

    Global Foundries and TSMC had disputes and subsequently reached a mutual licensing agreement over patent infringement. Both have decades of experience. So it's perfectly expected that IBM has touched several patents along the way.
  • The Hardcard - Wednesday, April 3, 2024 - link

    No doubt that happens, but IBM has and continues to dominate semiconductor research. It is almost impossible for anyone to not need IBMs blessings more than the other way around. Despite being unable to have profitable manufacturing, they have consistently and aggressively maintained an R & D lead.

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