This week at ISSCC (International Solid State Circuits Conference), Microsoft presented a talk titled ‘Xbox Series X SoC: A Next Generation Gaming Console’, with hardware engineer Paul Paternoster presenting. The 30 minute presentation covered a lot about Microsoft’s latest console processor, most of which was a repeat about what we saw at Hot Chips in August last year, however there was a new element in this presentation talking about how the console design team balanced acoustics, power, thermal performance, and processor yield, discussing where the hotspots in the design originate and where the performance/power targets of the final silicon were optimized.
One of the key metrics on how well a semiconductor process is developing is looking at its quantitative chip yield – or rather, its defect density. A manufacturing process...107 by Dr. Ian Cutress on 8/25/2020
Forecasting strong demand for its 5 nm and 7 nm class process technologies in the coming years, TSMC has announced that it's increasing its capital expenditure for 2019 by...18 by Anton Shilov on 10/18/2019
As vehicles are getting ‘smarter’ and gaining autopilot capabilities, it is easy to predict that the demand for higher-performing and more complex automotive SoCs will be growing rapidly in...29 by Anton Shilov on 10/14/2019
TSMC announced on Monday that its customers have started shipping products based on chips made by TSMC using its N7+ (2nd Generation 7 nm with EUV) process technology that...27 by Anton Shilov on 10/8/2019