EUV
This week ASML is making two very important announcements related to their progress with high numerical aperature extreme ultraviolet lithography (High-NA EUV). First up, the company's High-NA EUV prototype system at its fab in Veldhoven, the Netherlands, has printed the first 10nm patterns, which is a major milestone for ASML and their next-gen tools. Second, the company has also revealed that it's second High-NA EUV system is now out the door as well, and has been shipped to an unnamed customer. "Our High-NA EUV system in Veldhoven printed the first-ever 10 nanometer dense lines," a statement by ASML reads. "Imaging was done after optics, sensors and stages completed coarse calibration. Next up: bringing the system to full performance. And achieving the same results in the...
An AnandTech Interview with TSMC: Dr. Kevin Zhang and Dr. Maria Marced
In the past week, TSMC ran its 2021 Technology Symposium, covering its latest developments in process node technology designed to improve the performance, costs, and capabilities for its customers...
18 by Dr. Ian Cutress on 6/8/2021
SK Hynix to Build $106 Billion Fab Cluster: 800,000 Wafer Starts a Month
Capping off a busy week for fab-related news, South Korea authorities this week gave SK Hynix a green light to build a new, 120 trillion won ($106.35 billion) fab...
41 by Anton Shilov on 4/2/2021
EUV Pellicles Ready For Fabs, Expected to Boost Chip Yields and Sizes
Foundries started limited usage of extreme ultraviolet (EUV) lithography for high-volume manufacturing (HVM) of chips in 2019. At the time, ASML's Twinscan NXE scanners were good enough for production...
35 by Anton Shilov on 3/31/2021
TSMC: We have 50% of All EUV Installations, 60% Wafer Capacity
One of the overriding central messages to TSMC’s Technology Symposium this week is that the company is a world leader in semiconductor manufacturing, especially at the leading edge process...
32 by Dr. Ian Cutress on 8/27/2020
‘Better Yield on 5nm than 7nm’: TSMC Update on Defect Rates for N5
One of the key metrics on how well a semiconductor process is developing is looking at its quantitative chip yield – or rather, its defect density. A manufacturing process...
107 by Dr. Ian Cutress on 8/25/2020
TSMC Details 3nm Process Technology: Full Node Scaling for 2H22 Volume Production
At TSMC’s annual Technology Symposium, the Taiwanese semiconductor manufacturer detailed characteristics of its future 3nm process node as well as laying out a roadmap for 5nm successors in the...
58 by Andrei Frumusanu on 8/24/2020
Samsung to Produce DDR5 in 2021 (with EUV)
Samsung is on track to start volume production of DDR5 and LPDDR5 memory next year using a manufacturing technology that will take advantage of extreme ultraviolet lithography (EUVL). In...
20 by Anton Shilov on 3/25/2020
AMD Clarifies Comments on 7nm / 7nm+ for Future Products: EUV Not Specified
As part of AMD’s Financial Analyst Day 2020, the company gave the latest updates for its CPU and GPU roadmap. A lot of this we have seen before, with...
37 by Dr. Ian Cutress on 3/5/2020
TSMC & Broadcom Develop 1,700 mm2 CoWoS Interposer: 2X Larger Than Reticles
With transistor shrinks slowing and demand for HPC gear growing, as of late there has been an increased interest in chip solutions larger than the reticle size of a...
18 by Anton Shilov on 3/4/2020
Intel CFO: Our 10nm Will Be Less Profitable than 22nm [Morgan Stanley Transcription]
This week at Morgan Stanley’s Analyst Conference, Intel’s CFO, George Davis, sat down to discuss the future of where Intel’s profitability lies. No stranger to the odd comments relating...
92 by Dr. Ian Cutress on 3/4/2020
Samsung Starts Mass Production at V1: A Dedicated EUV Fab for 7nm, 6nm, 5nm, 4nm, 3nm Nodes
Samsung Foundry has started mass production of chips using its 6LPP and 7LPP manufacturing processes at its new V1 fab. The new facility employs one of the industry’s first...
30 by Anton Shilov on 2/20/2020
ASML Ramps Up EUV Scanners Production: 35 in 2020, Up to 50 in 2021
ASML shipped 26 extreme ultraviolet lithography (EUVL) step-and-scan systems to its customers last year, and the company plans to increase shipments to around 35 in 2020. And the ramp-up...
22 by Anton Shilov on 1/23/2020
TSMC Boosts CapEx by $1 Billion, Expects N5 Node to Be Major Success
TSMC is on track to begin high-volume production of chips using its 5 nm technology in the coming months, the company said in its conference call last week. While...
40 by Anton Shilov on 1/22/2020
Intel Hires Fab Veteran, Former GlobalFoundries CTO Dr. Gary Patton
Intel has hired Dr. Gary Patton, the former CTO at GlobalFoundries and an ex-head of IBM Microelectronics business. Dr Patton was leading Global Foundries leading edge processes before that...
21 by Anton Shilov on 12/11/2019
EUV Wafers Processed and TwinScan Machine Uptime: A Quick Look
One of the interesting elements that came out of some of our discussions at the IEDM conference this year revolve around the present deployment of EUV. Currently only one...
29 by Dr. Ian Cutress on 12/11/2019
TSMC: 5nm on Track for Q2 2020 HVM, Will Ramp Faster Than 7nm
TSMC’s 5 nm (N5) manufacturing technology is projected to provide significant benefits when it comes to performance, power, and area scaling, which is why the contract maker of semiconductors...
27 by Anton Shilov on 10/23/2019
EUV Demand is Up: EUV Device Manufacturer ASML Beats Sales Estimates
Between the smartphone revolution, cloud computing, and the Internet of Things, the demand for cutting-edge chips has never been higher. And if you have any doubts about that, then...
46 by Anton Shilov on 10/16/2019
Hot Chips 31 Keynote Day 2: Dr. Phillip Wong, VP Research at TSMC (1:45pm PT)
The keynote for the second day is from TSMC, with Dr. Phillip Wong taking the stage to talk about the latest developments in TSMC's research and portfolio. The talk...
12 by Dr. Ian Cutress on 8/20/2019
Samsung’s Aggressive EUV Plans: 6nm Production in H2, 5nm & 4nm On Track
Samsung Foundry formally started to produce chips using its 7LPP (7 nm low power plus) fabrication process last October and has not slowdown development of its manufacturing technologies since...
42 by Anton Shilov on 7/31/2019
TSMC: 3nm EUV Development Progress Going Well, Early Customers Engaged
Development of new fabrication technologies never stops at leading-edge companies such as TSMC. Therefore, it is not surprising to hear the annoucement that development of TSMC’s 3nm node is...
76 by Anton Shilov on 7/23/2019
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